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        IC substrate

        Encapsulated Type Trandition Encap ( QFP、BGA) Wafer Level CSP
        Advantage
        1. High Process Yield
        2. Mature material and equipment 
        1. Small Size Avaliable 
        2. Low Running Cost
        3. Simplfy Process
        4. Fine Pitch Avaliable
        Disadvantage
        1. Fine Pitch Design
        2. Complicated Process
        3. High Running Cost
        Less I/O Pin A(<100)

        WAFER LEVEL-CSP Flux Stencil

         

        • PAD Opening Design: X1: Opening(Upper),X2=Opening(Lower) / X2 – X1 = 2~6um(Adjustable)
        • Stencil Thickness (MF) : MF : 20~100um(Adjustable)
        • Tension (N): 20~34N(Adjustable)

        WAFER LEVRL CSP - Ball Stencil

        • PAD Opening Design: X1 is based on the solder ball size ; X3 – X2 = 2~6um(Adjustable)
        • Stencil Thickness (CT): CT:15~30um(Adjustable)
        • Metal Foil Thickness (MF1 & MF2) : MF1 : 80~130um(Adjustable) ; MF2:200~250um(Metal or Polymer)
        • Tension (N): 20~34N(Adjustable)

        The comparsion of inner surface roughness 

        Compared FAITHFUL Stencil and Japen Stencil on Opening Dimension.

        FAITHFUL's ElectroForming Stencil had better performance than Japen's Stencil.

        Compared FAITHFUL Stencil and Japen Stencil on Ink Deposite Performance.

        FAITHFUL's ElectroForming Stencil had better performance than Japen's Stencil.

        Stencil Application and Surface Technology

         

        The Stencil Specification of Wafer Level CSP Application 

        Basement Layer
        Available Wafer Size 6~12 inch Wafer 
        Material NiCo Alloy
        Accumulated Accuracy: +/-0.01%Length
        Thickness Range(μm) 20~200
        Thickness Accuracy(μm) (Pattern Area)
        20~50μm(+/-3μm)
        51~100μm(+/-10μm)
        101~200μm(+/-20μm)
        Minimum Opening (μm) 50μm
        Minimum Space (μm) 50μm
        Opening Aperture Accuracy(μm)
        +/-3μm(Thickness Range:20~50μm)
        +/-5μm(Thickness Range:51~100μm)
        +/-5μm(Thickness Range:101~200μm)
        Aspect Ratio ≦1:1.2
        Support Layer
        Material Polymer or NiCo Alloy
        Alignemnet Space(μm) 30μm/side
        Thickness Accuracy(Pattern Area)
        Polymer:+/-3μm
        NiCo Alloy:+/-10μm
        Minimum Support Area(μm) 40μm×40μm
        Minimum Support Width(μm) 40μm×40μm
        Product
        Aspect Ratio ≦1:1.2
        Tension(N) 20~34

        The Advantage of FAITHFUL Electroforming Stencil with polymer supporting layer

        • High Accumulated Accuracy and Precised Metal Thickness.
        • Using polymer supporting layer can make sure excellent stecncil flatness and the uniformity of thickness can below 3μm.
        • The charateristic of Faithful electroforming stencil is long life time because we selected the Ni/Co alloy as our soultion basement.
        • It can be avoid the wafer damaged issue happen by the stencil we desinged with the supporting layer on the stencil.

        Diagram Index

        • The space of polymer is  X :50~500μm(Depend on the product design)

        Diagram Index

        • The space of polymer is  X :50~500μm(Depend on the product design)
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